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Calculators · free · formulas shown

The numbers an AI infra loop expects you to do in your head

Four tools built on the same formula sheet the interview rounds use. Each one prints the calculation next to the result, because the goal is to leave able to do it on a whiteboard, not to depend on the page. Hardware specs are vendor dense peaks as of September 2026; model presets come from each model's published config.

The spec sheet behind the tools

Dense tensor peaks only. Vendor headline numbers usually include 2:1 structured sparsity, which doubles them and which no dense GEMM reaches. The ridge point is the peak divided by memory bandwidth, the intensity a kernel needs before compute becomes the limit.

AcceleratorMemoryBandwidthbf16 densefp8 denseRidge (bf16)Note
A100 80GB SXM80 GB2.04 TB/s312 TFLOPSn/a153 FLOP/BNo FP8 tensor cores; INT8 is 624 TOPS dense.
H100 80GB SXM80 GB3.35 TB/s989 TFLOPS1,979 TFLOPS295 FLOP/B
H200 141GB SXM141 GB4.8 TB/s989 TFLOPS1,979 TFLOPS206 FLOP/BSame compute die as H100; the upgrade is memory capacity and bandwidth.
B200 (HGX)180 GB8 TB/s2,250 TFLOPS4,500 TFLOPS281 FLOP/BAnnounced at 192 GB; the HGX B200 datasheet lists 180 GB usable. Numbers here are dense; NVIDIA's headline figures include 2:1 sparsity.
B300 (Blackwell Ultra)288 GB8 TB/s2,500 TFLOPS5,000 TFLOPS313 FLOP/BPer-GPU figures derived from NVIDIA's GB300 NVL72 rack numbers divided by 72; FP64 was cut to about 1.2 TFLOPS, so this is an inference and low-precision part. Medium confidence on TDP.
MI300X192 GB5.3 TB/s1,307 TFLOPS2,615 TFLOPS247 FLOP/BMeasured LLM inference throughput has trailed the spec sheet more than on NVIDIA parts; treat the peak as a ceiling, not a forecast.
MI325X256 GB6 TB/s1,307 TFLOPS2,615 TFLOPS218 FLOP/BAnnounced at 288 GB, shipping at 256 GB.
MI355X288 GB8 TB/s2,500 TFLOPS5,000 TFLOPS313 FLOP/BCDNA 4, shipping since Q3 2025. AMD's peaks are dense (it does not market sparsity figures). Liquid-cooled; the MI350X is the 1,000 W air-cooled sibling at about 2.3 PFLOPS bf16.
TPU v5e16 GB0.82 TB/s197 TFLOPSn/a240 FLOP/BINT8 is 393 TOPS. Pods of 256 chips over ICI; sized for serving and small-model training. ICI is 400 GB/s bidirectional per chip.
TPU v6e (Trillium)32 GB1.64 TB/s918 TFLOPSn/a560 FLOP/BINT8 is 1,836 TOPS. 256-chip pods. ICI is 800 GB/s bidirectional per chip.
TPU v7 (Ironwood)192 GB7.37 TB/s2,307 TFLOPS4,614 TFLOPS313 FLOP/BGA April 2026. First TPU with native FP8. Pods of 9,216 chips on a 3D torus; JAX and PyTorch only.
Trainium296 GB2.9 TB/s667 TFLOPS1,299 TFLOPS230 FLOP/BEight NeuronCore-v3 per chip; Trn2 UltraServers link 64 chips over NeuronLink.
Trainium3155 GB4.9 TB/s671 TFLOPS2,517 TFLOPS137 FLOP/BGA December 2025 on TSMC 3 nm. Memory is quoted as 144 GiB (about 155 GB decimal). Adds MXFP8/MXFP4 and structured sparsity; Gen2 UltraServers link 144 chips over NeuronLink v4.

As of September 2026. Refreshed on each new generation; older parts stay because fleets keep them.

Then practise the questions these numbers come from